Enhancement the Performance of Heat Sink by Using Metal Foam

Abstract

Portable electronic devices must have effective thermal management to maintain low enough working temperatures for dependability, expanded installed functionality, and user comfort. In certain situations, using heat sinks made of metal foam has the potential for heat dissipation. In the research, three cases were employed with and without copper foam, forced air convection into the device's duct, and electric heating of the copper plate under the heat sink. For each of the three heat sink scenarios, which happen again with different porosities throughout the heating and cooling processes, the effects of the thermal power and input air velocity parameters of metal foam were investigated. The findings indicate that the copper plate in case 3, which features two copper foams, has the lowest temperature among the three cases. The temperature dropped during the heating process in cases 3 (two pieces of copper foam) and 2 (one piece of copper foam) at porosity 90% (198%) and 95% porosity (197.6%) for case 3 and 45.2% and 46.8% for case 2, respectively, compared to case 1 (no copper foam). Because of its high heat conductivity, the copper plate in case 3 maintained its temperature during the cooling process. Compared to case 1, the improvement rates in the copper foam example were 86% and 77% lower, respectively. Temperature was less affected by increasing the input air velocity.